Model: HE040BL016-39IC-10A
Four inches at 640×480 is the size and resolution most retro handhelds are built around, and this IPS module is our version of it: a true 4:3 panel, 2.14 mm thick, with a parallel RGB interface that connects directly to the application processors used in handheld consoles.
The 200 PPI panel keeps pixel art clean and menu text readable, while the larger screen area makes the device easier to play than a 3.5-inch class handheld — the reason this size has become the default for the category.
| Item | Specification |
|---|---|
| Model No. | HE040BL016-39IC-10A |
| Display size | 4.0 inch |
| LCD type | IPS, Normally Black |
| Resolution | 640 × (RGB) × 480 |
| Aspect ratio | 4:3 |
| Module outline | 85.18 × 68.80 × 2.14 mm |
| Viewing direction | Full view |
| Interface | RGB |
| Pixel density | 200 PPI |
| Touch option | Capacitive touch panel (CTP) with optical bonding |
The size the market already expects. Shells, buttons and board layouts for retro handhelds are commonly designed around a 4-inch 4:3 screen. Building on this module keeps your mechanical design close to a proven footprint instead of forcing custom tooling.
Native 4:3, no letterboxing. Games authored for 4:3 fill the panel completely — no black bars, no stretching, no cropping.
2.14 mm thin. The same thickness as our 4.7-inch high-resolution module, so a slim shell stays possible even with a larger battery behind the display.
RGB keeps the board simple. A parallel RGB interface is the straightforward route for the SoCs used in this class of device. MIPI, LVDS and SPI versions of our small displays are available where your design calls for them.
IPS, Normally Black. Colors and contrast hold across the full viewing angle — handhelds are rarely held straight — and dark scenes stay dark rather than grey.
Over 60% of the modules we ship are customized. For this display we can adapt cover glass shape, thickness, printing and openings; optical bonding, with or without a capacitive touch panel; FPC length, shape and pin definition; backlight brightness and driving; and interface definition.
Optical bonding removes the air gap behind the cover glass, cutting reflection, deepening contrast and adding impact strength to a device designed to be carried everywhere.
Every module is produced under an IATF 16949 quality system in our own factory in Shanggao, Jiangxi, in 4,000 m² of Class 1,000 cleanroom. Each unit is 100% lighting-tested before shipment, and new designs are validated with high- and low-temperature cycling, damp-heat aging, ESD, drop and vibration testing. Our factory also holds ISO 9001, ISO 14001, ISO 45001 and IECQ QC 080000 certification, and all modules comply with RoHS, with third-party reports available on request.
Retro gaming handhelds, portable emulation devices, handheld game consoles, tabletop and mini arcade machines, game controllers with built-in screens, and 4:3 instrument or terminal panels.
Send us your shell drawing, SoC and interface, cover glass and touch requirement, target refresh rate and estimated annual quantity. Our engineers will confirm the specification, quote the module and arrange samples — built on the same automated lines used for mass production.

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